金十数据·快讯·· 19 小时前精选
A股先进封装板块齐涨，传台积电拟将先进封装价格上调最高20%
China A-share advanced-packaging stocks rallied, with Changdian Technology, Tongfu Microelectronics, Huatian Technology, Shen Technology and Taiji Industrial rising in tandem. Reports say TSMC plans to raise advanced-packaging prices by up to 20%.
AI 导读
A股先进封装板块集体上涨，长电科技、通富微电、华天科技、深科技、太极实业同步走高。报道称台积电计划将先进封装价格最高上调20%。
推荐理由
把A股先进封装板块的同步上涨与台积电拟提价传闻放在一处，读者可据此理解涨价消息对产业链的情绪传导。
来源：金十数据·快讯 · jin10.com